מאפיינים מרכזיים

X7056-II An Innovative Inline X-ray system
Maximum inspection result stability
Ultra-fast inspection times
Maximum flexibility
Combined AOI/AXI saves space
Long-term investment security

The X7056-II's state-of-the-art X-ray technology ensures precise inspection of high-end electronics. The inline X-ray system has won five international awards for its extremely high throughput and outstanding image quality. Even concealed solder joints and components are displayed as crystal-clear slice images to guarantee seamless quality control. The option to also integrate AOI inspection within the system and to perform combined inspections is a special feature of the X7056-II – an efficient, space-saving highlight that provides fast and comprehensive inspection results.

  • System can be used as a 3D AXI system or combined 3D AXI / 3D AOI
  • Revolutionary xFastFlow handling concept for changing printed circuit boards in as little as 4 seconds
  • Ultra-thorough inspection of single or double-sided electronic assemblies
  • Three different flat panel detector sizes for scalable throughput
  • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI
  • inspection library
  • Maximum inspection program optimization through integrated verification
  • Additional vertical slices for optimum analyses and dependable verification
  • High-quality 3D AXI volume calculation with planar CT



System housing:

1493 mm x 1631 mm x 2251 mm (W x H x D)


Width with xFastFlow: 1933 mm






Flat panel detectors (FPD), 14-bit grayscale value depth


6 – 32 μm/pixel*


1 FPD on X/Y table, 5 fixed FPDs (additional available upon request)





Inspection methods:

2D, 2.5D, 3D as X-ray only or as combined AOI/AXI system


AOI 65cm²/s, AXI depends on configuration





PCB dimensions:

450 mm x 350 mm* (L x W)





User interface:

Viscom vVision/EasyPro



*Depending on configuration


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